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Posted by
Two Blokes Jun 8 -
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Stock
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As the benefits of Moore's law reach their limits, advances in chip performance turn to the back end of production. Back-end semiconductor processing is booming due to limits in front-end innovation. Advanced packaging, like TSMC's 2.5D CoWoS, is crucial for AI chip performance as Moore's Law slows. There is a significant packaging bottleneck for AI chips, with Nvidia consuming most of TSMC's CoWoS-L capacity.
