Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

  • TEMPE, Ariz., May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies today announced the signing of an agreement with IBM to implement Deca's M-Series\u2122 and Adaptive Patterning\u00ae technologies in IBM's advanced packaging facility in Bromont, Quebec.